EnSilica plc, a fabless, application-specific chipmaker, has raised approximately £9.7 million through a placing and subscription of new ordinary shares

The Abingdon firm has also launched an offer to retail investors via the BookBuild Platform which aims to raise up to £300,000.

The first tranche of the placing of approximately £4.54m is expected to complete next week, with the second tranche of approximately £5.16m expected to complete on or around 8th April 2026.